The Universal Selection Source: Adhesives Ingredients

Epoxy
Epoxies are created by polymerizing a mixture of two starting compounds, the resin and the hardener. Epoxy adhesives are thermosetting resins which solidify by polymerization and, once set, will soften but not melt on heating. Two-part resin/hardener epoxy systems will solidify on mixing (sometimes accelerated by heat), while one-part epoxy adhesives require heat to initiate the reaction of a latent catalyst. The properties of epoxy adhesives are also varied through the use of fillers. Thanks to their versatility and relatively low cost, they find application in wide range of formulations.

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Jul 17, 2017 | Product News

Extremely Flexible One-component Thermally Conductive Epoxy Adhesive

Creative Materials has introduced 127-31, a unique extremely flexible one-component thermally conductive epoxy adhesive. This 100% solids epoxy adhesive, encapsulant, and potting compound, is...

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Jul 5, 2017 | Product News

Chimet Introduces Electrically Conductive Adhesive for Low Stress Solder Join

Chimet has introduced Ag910EI, a one-component epoxy conductive adhesive. The new isotropic ECA is RoHS compliant and can be applied by pick & place, stencil and syringe. Screen printing is allowed...

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Jun 13, 2017 | Product News

EpoxySet Unveils Two Part Epoxy Potting Compound

Epoxyset has unveiled EC-1030FL, a flexible, two part epoxy designed to replace silicones for potting, encapsulating, and casting applications where temperatures up to 200°C are required...

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May 30, 2017 | Product News

Henkel Unveils Epoxy-based Hybrid Adhesives for Maintenance Industry

Henkel has introduced Loctite Universal Structural Bonders; innovative adhesives powered by a patented Hybrid technology that combines the most critical attributes of structural, instant and epoxy...

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May 15, 2017 | Product News

Lohmann Develops New Range of Epoxy Tapes for Structural Bonding

Lohmann has developed 7 + 1 Epoxy-Tapes, which are suitable for the structural bonding of a wide variety of materials. Two different adhesive variants are available as tapes, one of which is...

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Jul 17, 2017 | Product News

Room Temperature Curing Epoxy for Bonding & Sealing Applications: Master Bond

Master Bond has developed EP39MAOHT, a room temperature epoxy curing system. The system is used for demanding bonding, sealing, coating, potting and encapsulation applications. It combines...

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Jun 27, 2017 | Product News

Master Bond Develops Fast Curing Two-Part Epoxy for Bonding & Sealing Applications

Master Bond has developed EP41S-F, a two part epoxy for bonding, sealing, coating and encapsulation applications. It combines fast ambient temperature cure speed with chemical resistance and...

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Jun 5, 2017 | Product News

Master Bond Formulates EP93FRHT, a Non-halogenated Epoxy Compliant to Airbus Standards

Master Bond’s non-halogenated system can be used for bonding, sealing and encapsulating applications in aircraft requiring stringent Airbus specifications. It is most likely to be used in the...

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May 16, 2017 | Product News

Master Bond Develops Two Component, Low Viscosity Epoxy for Potting Small Components

Master Bond has developed EP62-1BF, a two part epoxy featuring the ability to withstand exposure to aggressive chemicals. EP62-1BF is easy to handle with a long open time of 12-24 hours at 75°F for...

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May 4, 2017 | Product News

DELO Unveils Epoxy-based Adhesive for Optoelectronic Applications

DELO has introduced DUALBOND OB786, a new adhesive for optoelectronic applications. It is a UV-heat curing adhesive and is particularly suited for fixing components within seconds while ensuring...

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