Energy savings plus mechanical reinforcement and rheology control

2K Epoxy Adhesive for Self-Leveling Flooring by Dow Chemicals

Adhesives Formulation

Applicable Type

Reactive Adhesives , Epoxy Adhesives

Applicable Base Polymer

2 Component

Applicable Industrial Sectors

Buildings & constructions

Applicable Base Polymer Properties

Because of their thermosetting molecular structure, epoxy adhesives exhibit excellent tensile-shear strength but poor peel strength unless modified with a more resilient polymer. Epoxy adhesives offer excellent resistance to oil, moisture, and many solvents. Low shrinkage on curing and high resistance to creep under prolonged stress are characteristics of many high quality epoxy adhesives. Epoxy resins have no evolution of volatiles during cure and are useful in gap-filling applications.

Typical Formulation Ingredients

Phase

Ingredient

Parts by weight

Epoxy resin (DER 324, Dow Chemical)

xxx

Anti-foaming agent (BYK A-525, BYK-Chemie)

xxx

Amine curing agent (Ancamine 1618, Air Products)

xxx

Fillers

Quartz sand (0.1-0.3 mm)

xxxxx

Fillers

Quartz Flour (<0.6 mm)

xxxxx

Fillers

Pigment (titanium dioxide or iron oxide)

xxxx

Typical Properties

Properties

Mixed viscosity @ 25°C, mPa-s

xxxxxx

Viscosity of binder only @ 25°C, mPa-s

xxx

Pot life (time to 100 Pa-s), min: Clear binder (100 gm)

Pot life (time to 100 Pa-s), min: Formulation (150 gm)

xxx

Processing

Resulting Properties

Self-leveling flooring formulations, typically up to 3 mm, contain a low filler/binder ratio and are therefore relatively free-flowing. Such formulations are characterized by their excellent balance between chemical resistance and physical properties and, in the majority of cases, high gloss. Typical applications include decorative floorings or flooring systems designed for light traffic. The chemical nature of the DER 324 epoxy resin combines a good resistance against acids with a sufficient high level of resistance against slow, as well as rapid, deformation (impact).

Tips and Tricks

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