Typical Formulation Ingredients
Phase
Ingredient
Parts by weight
B
Hypo ATBN 1300x16 (Emerald)
B
Polypox P 502 curing agent - a blend of n,n-dimethyl-1,3-diaminopropane and polyaminoamide (UPPC, Germany)
Typical Properties
Percent mass parts of ATBN in total
Glass transition temperature, °C
Lap-shear strength (On untreated aluminum alloy), MPa
Lap-shear strength (On acid etched aluminum alloy), MPa
Resulting Properties
The above table presents typical two component epoxy adhesive formulations using SiO2 nanoparticle and ATBN toughening agents. Tensile shear strength and temperature resistance of these adhesives are relatively high. Peel strength is also high and does not decrease rapidly with lower temperatures. The durability of modified epoxies is satisfactory as measured by most long term moisture tests.
(Source: Evonik also A. J. Kinloch , et.al., “Toughening Structural Adhesives via Nano- and MicroPhase Inclusions”, The Journal of Adhesion, 79:8-9, 867-873, 2003)