Ethylene Vinyl Acetate HMA for Difficult Substrates

Typical Formulation Ingredients

Phase

Ingredient

Parts by weight

A

Ethylene vinyl acetate copolymer resin (28% vinyl acetate, melt index of 25)

xx

A

Microcrystalline wax (190°F to 195°F melting point)

xx

A

Tackifier (Zonarez B-125, Talas)

xx

Typical Properties

Properties

Brookfield viscosity@350°C, cps

xxxxx

Brookfield viscosity@390°C, cps

xxxx

Sealing temperature, °F

xxx

Kraft to Kraft Adhesion oz / inch

xx

Kraft to Polyethylene Adhesion oz / inch

xx

Kraft to Aluminum Foil Adhesion oz / inch

xx

Processing

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Resulting Properties

A starting formulation for a general purpose, EVA hot melt adhesive formulation for bonding difficult substrates (e.g., polyethylene and polypropylene) is given in the table above. The adhesive is stable at high temperatures. It will adhere to most packaging foils and films, including polypropylene. It has increased tackiness and heat sealable properties.

(Source: Adhesives Formulary Handbook, NIIR Board, Asia Pacific Business Press, Inc., 2010, p. 259.)

Tips and Tricks

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