Applicable Base Polymer Properties
Latent curing agents, such as dicyandiamide, are commonly used in producing solid epoxy adhesives. Being latent, these curing agents react with epoxies only on heating. They are relatively insoluble in the epoxy resin at room temperature, yet melt and become soluble at an activation temperature. Once activated, they cure relatively quickly at elevated temperatures. Dicyandiamide provides excellent high temperature properties.