Ultra fine calcium carbonate Omyabond 120

General Purpose Room or Elevated Temperature Cure 2K Epoxy Adhesive

Adhesives Formulation

Applicable Type

Acrylic Adhesives , Epoxy Adhesives

Applicable Industrial Sectors

Buildings & constructions , Electrical & Electronic Bonding , Transportation (excl. Automotive)

Applicable Base Polymer Properties

Because of their thermosetting molecular structure, epoxy adhesives exhibit excellent tensile-shear strength but poor peel strength unless modified with a more resilient polymer. Epoxy adhesives offer excellent resistance to oil, moisture, and many solvents. Low shrinkage on curing and high resistance to creep under prolonged stress are characteristics of many high-quality epoxy adhesives. Epoxy resins have no evolution of volatiles during cure and are useful in gap-filling applications.

Typical Formulation Ingredients

Phase

Ingredient

Parts by weight

Epoxy resin, 180-190 EEW (Epon 828, Momentive)

xxxx

Fumed silica (Aerosil 300, Evonik Degussa Corp.)

xxx

Polyamide-amine curing agent (Versamid G490, Gabriel Phenoxies)

xxxx

Typical Properties

Properties

Non-volatile, %

xxx

Pot life at 25°C, hrs

Lap shear strength after full cure (316 stainless steel), psi

xxxx

Time, hrs, for 1mm thickness to reach full cure at:

25°C

xxxxx

50°C

xxxxx

100°C

xxxxxxxx

Processing

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Resulting Properties

It is an epoxy formulation that can be used to bond metal, wood, cement and selected plastics. Key application includes structural bonding in:

Building and construction
Transportation
Electrical and Electronic
General assembly

Polyamide curing agents, such as Versamid G490, provide:

Excellent flexibility
Electrical properties, and
Moderately good outdoor weather resistance

Similar epoxy systems can be used as adhesives, sealants, potting compounds, coatings, and flooring compounds.

A formulation by Gabriel Phenoxies Inc., Rock Hill, SC, USA

Tips and Tricks

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