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Adhesives Ingredients
The material selection platform
Adhesives Ingredients

Low Viscosity Epoxies for Heat Curable Textile Binder (A) by Momentive

Adhesives Formulation

Applicable Base Polymer
Applicable Industrial Sectors

Applicable Base Polymer Properties

Because of their thermosetting molecular structure, epoxy adhesives exhibit excellent tensile-shear strength but poor peel strength unless modified with a more resilient polymer. Epoxy adhesives offer excellent resistance to oil, moisture, and many solvents. Low shrinkage on curing and high resistance to creep under prolonged stress are characteristics of many high quality epoxy adhesives. Epoxy resins have no evolution of volatiles during cure and are useful in gap-filling applications.

Typical Formulation Ingredients

Phase
Ingredient
Parts by weight
Epoxy resin (Epon 828, Momentive) 
xxx 
Cycloaliphatic amine curing agent (Epikure 3300, Momentive) 
xxxx 

Typical Properties

Properties
Gel time, 100 gm mass, mins 
xxx 
Cure schedule, mins @ °C 
xxxxxxxxxxxxxxxxxxxxxxxxx 
Glass transition temperatures, °C 
xxx 
Tensile strength, psi 
xxxxx 
Tensile elongation, % 
xxx 
Hardness, Shore D 
xx 
Weight loss, 24 hrs at 150°C 
xxx 

Processing

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Resulting Properties

Because of their thermosetting molecular structure, epoxy adhesives exhibit excellent tensile-shear strength but poor peel strength unless modified with a more resilient polymer. Epoxy adhesives offer excellent resistance to oil, moisture, and many solvents. Low shrinkage on curing and high resistance to creep under prolonged stress are characteristics of many high quality epoxy adhesives. Epoxy resins have no evolution of volatiles during cure and are useful in gap-filling applications.

Tips and Tricks

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