Energy savings plus mechanical reinforcement and rheology control

Polyamide Heat Sealable Coating for Low Temperature Application

Adhesives Formulation

Applicable Type

Hot-melt Adhesives

Applicable Base Polymer

Polyamides (PA)

Applicable Industrial Sectors

Papers & Packagings

Applicable Base Polymer Properties

Polyamide HMAs have exceptionally high shear strength and impact resistance. Their creep, temperature, and chemical resistance are also relatively good for a thermoplastic hot melt. Unfortunately, this also means that the application temperature for polyamide hot melt adhesives is much higher than what is required for conventional formulated hot melt adhesives such as those based on ethylene vinyl acetate (EVA) or styrene butadiene copolymer (SBC). This limits the applications of polyamide hot melts to substrates that are not temperature sensitive. The polyamides that are used for adhesives generally fall into three groups that are defined by molecular weight. Polyamides of differing molecular weight and chemical structure are often employed to provide specific application and performance properties.

Typical Formulation Ingredients

Ingredient

Parts by weight

Polyamide resin (Versamid 940, BASF)

Plasticizer (e.g., Staybelite Ester 10, Eastman Chemical)

(Source: Adhesives Formulary Handbook, NIIR Board, Asia Pacific Business Press, Inc., 2010, p. 244.)

Typical Properties

Properties

Especially useful as a heat seal coating where strength retention at low temperatures is required

Good adhesion to a wide variety of substrates

Good flexibility

Processing

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Resulting Properties

Polyamide hot melt adhesives have better heat resistance than EVA or SBC types and use fewer additives. Certain types of polyamide hot melts can withstand 200°C over the short term without degradation, although creep is generally a problem. Polyamide adhesives generally exhibit sufficient properties, such as tack, without the use of additives. However, the base polyamide resin generally costs more than more conventional hot melt resins that rely on formulation for optimum performance. It is important to minimize the time when the molten resin is exposed to oxygen.