Energy savings plus mechanical reinforcement and rheology control

Waterborne Epoxy Resins Cured with Dicyandiamide (C) by Momentive

Adhesives Formulation

Applicable Type

Waterborne Adhesives , Reactive Adhesives , Epoxy Adhesives

Applicable Base Polymer

Epoxies (EP)

Applicable Industrial Sectors

Buildings & constructions

Applicable Base Polymer Properties

Waterborne epoxy dispersions have been employed effectively for many years in the coatings market primarily for the surface protection of concrete and metals. These products were developed in response to environmental regulations to reduce solvent levels in coatings. Since these dispersions adhere well to a wide variety of substrates and provide a high degree of strength and resistance to service environments, they have also naturally found applications as adhesives.

Typical Formulation Ingredients

Phase

Ingredient

Parts by weight

Epoxy resin dispersion (Epi-Rez 5003-W-55, Momentive)

xxx

Dicyandiamide (SKW Corporation)

xxx

2-Methyl imidazole (BASF)

xxxx

Deionized water

Typical Properties

Properties

Gel time at 171°C, seconds

xxx

Estimated pot life, days

Processing

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Resulting Properties

Epi-Rez 3522-W-60, Epi-Rez 5520-W-60, and Epi-Rez 5003-W-55 are nonionic, completely aqueous dispersions of epoxy resins. Epi-Rez WD-510 is a liquid, bisphenol A epoxy resin specifically designed for water dilution. Dicyandiamide can be used as a curing agent with these epoxy resins to provide extended pot life formulations which cure at elevated temperatures (for example, 300°-350°F) to give highly crosslinked systems suitable for service at high temperature. Suggested uses include: prepregs and composites, nonwoven binders, adhesives, and electrical insulating materials.

(Source: Momentive)

Tips and Tricks

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