The Universal Selection Source: Adhesives Ingredients

2 Formulations found
Polyamide/Resin HMA for General Purpose Bonding
  • Applicable Type: Hot melt Adhesives
  • Applicable Base Polymer: Polyamides PA
  • Applicable Industrial Sectors: Papers & Packagings
Polyamide Heat Sealable Coating for Low Temperature Application
  • Applicable Type: Hot melt Adhesives
  • Applicable Base Polymer: Polyamides PA
  • Applicable Industrial Sectors: Papers & Packagings
Showing 1 - 10 of 2 Formulations matching your search
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