The Universal Selection Source: Adhesives Ingredients

2 Formulations found
Polyamide/Resin HMA for General Purpose Bonding
  • Applicable Type: Hot melt Adhesives
  • Applicable Base Polymer: Polyamides PA
  • Applicable Industrial Sectors: Papers & Packagings
Polyamide Heat Sealable Coating for Low Temperature Application
  • Applicable Type: Hot melt Adhesives
  • Applicable Base Polymer: Polyamides PA
  • Applicable Industrial Sectors: Papers & Packagings
Showing 1 - 10 of 2 Formulations matching your search

Online Course

Edward Petrie
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Thursday Mar 30 2017

By Edward Petrie

Avoid premature bond failure when bonding dissimilar materials (LSE plastics, metal, composites, ceramics…) by learning how to efficiently manage the problem of internal stress and cure shrinkage.

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