The Universal Selection Source: Adhesives Ingredients
A SpecialChem client is seeking a flexible or curved display module.
It must exhibit proper optical, mechanical, electrical & thermal interface performance and fulfill the automoti...
This technology estate comprises patents that all share one aspect, they are made to be biodegradable.
These biodegradable materials were intended for the use in Kimberly-Clark Co...
Impact Modification Strategies for Engineering Polymers
Feb 28, 2017
More info and registration
Sensory Claims in Cosmetics: Supporting Ingredients & Tests
Mar 1, 2017
Introduction to Pigment Dispersion & Stabilization- Part 1
Mar 2, 2017
Hot melt Adhesives
Solvent borne Adhesives
UV/EB Cure Adhesives
Feb 23, 2017 |
Emery Oleochemicals has announced its EMEROX® Azelaic Acid as an alternative to sebacic acid. EMEROX. It is used in polyamide hot melts and low temperature and polymeric plasticizers. Azelaic Acid...
Feb 21, 2017 |
Master Bond has developed EP30LP-2, a two component epoxy with a low viscosity and a volume resistivity of over 1014 ohm-cm, making it well suited for potting and encapsulation applications. This...
Feb 14, 2017 |
Graphene 3D has unveiled line of highly electrically conductive carbon epoxies. This line of products will be distributed under the G6-EPOXY trade name. G6-Epoxy resin works in different temperature...
Feb 10, 2017 |
At the European Coatings Show 2017, WACKER is presenting four specialty grades pyrogenic silica. Applications range from rheology control in high-quality surface coatings, basic systems, adhesives...
Feb 3, 2017 |
At Interpack 2017, BASF will present a range of innovations for packaging. It will present its water-based adhesives, partly bio-based Copolyamides. It will also present innovative biomass balance...
Feb 22, 2017 |
Gelest has unveiled SIVATE™ A610 activated amine functional silane for use as or a primer for high-speed UV-acrylated urethane cure systems, a coupling agent for high speed epoxy adhesive bonding...
Feb 15, 2017 |
H.B. Fuller has introduced Active Alignment (AA) adhesives designed for camera module assembly at IPC APEX EXPO.The products are formulated to offer high UV penetration at short UV exposure times...
Panacol has introduced newly developed structural adhesive Structalit® 8801 T, which cures rapidly at low temperatures. The epoxy adhesive was specially formulated for temperature-sensitive...
Feb 6, 2017 |
HERMA has developed 62F, new clear-on-clear label adhesive. The adhesive delivers the no-label look even in challenging conditions, including extreme moisture. Endowed with excellent durability and...
Feb 2, 2017 |
WACKER will showcase a new polymeric binder for formulating in two-component cementitious sealing slurries. VINNAPAS® 760 ED is a terpolymer based on vinyl acetate, ethylene and vinyl ester that...
Avoid premature bond failure when bonding dissimilar materials (LSE plastics, metal, composites, ceramics…) by learning how to efficiently manage the problem of internal stress and cure shrinkage.
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