The Universal Selection Source: Adhesives Ingredients

Aug 8, 2017 | Product News

Master Bond’s Newly Developed One-component Elastomeric Compound Meets ISO 10993-5 Specifications

Master Bond has developed X21Med, a single component elastomeric compound. It is a solvent-based system that is easy to apply and process. The product passes ISO 10993-5 tests for cytotoxicity...

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Jun 27, 2017 | Product News

Master Bond Develops Fast Curing Two-Part Epoxy for Bonding & Sealing Applications

Master Bond has developed EP41S-F, a two part epoxy for bonding, sealing, coating and encapsulation applications. It combines fast ambient temperature cure speed with chemical resistance and...

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Mar 24, 2017 | Product News

Master Bond Develops One Part, Toughened Epoxy System for Dam-and-fill Encapsulation

Master Bond has developed one part epoxy system: Master Bond Supreme 3HTND-2DM for use in the dam-and-fill method for chip-on-board encapsulation. Master Bond Supreme 3HTND-2DM is a rapid curing...

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Jan 31, 2017 | Product News

Master Bond Unveils EP30TC, a 2C Epoxy for Potting & Sealing Applications in Aerospace

Formulated for use in demanding thermal management applications, Master Bond EP30TC is a two component epoxy that contains robust thermally conductive filler with very fine particle sizes. This NASA...

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Nov 22, 2016 | Product News

Master Bond Develops X5TC, a One Component Elastomeric System

Master Bond has developed Master Bond X5TC, an elastomeric system for bonding & sealing applications in aerospace, electronics & specialty OEM applications. This compound is suitable for bonding...

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Jul 17, 2017 | Product News

Room Temperature Curing Epoxy for Bonding & Sealing Applications: Master Bond

Master Bond has developed EP39MAOHT, a room temperature epoxy curing system. The system is used for demanding bonding, sealing, coating, potting and encapsulation applications. It combines...

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May 16, 2017 | Product News

Master Bond Develops Two Component, Low Viscosity Epoxy for Potting Small Components

Master Bond has developed EP62-1BF, a two part epoxy featuring the ability to withstand exposure to aggressive chemicals. EP62-1BF is easy to handle with a long open time of 12-24 hours at 75°F for...

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Feb 21, 2017 | Product News

Master Bond Develops Low Viscosity Epoxy for Potting and Encapsulation

Master Bond has developed EP30LP-2, a two component epoxy with a low viscosity and a volume resistivity of over 1014 ohm-cm, making it well suited for potting and encapsulation applications. This...

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Dec 20, 2016 | Product News

Master Bond Unveils High-temperature Resistant Epoxy

Master Bond has developed EP46HT-2AO Black. This two component system blends thermal stability with a high strength profile for a variety of bonding, sealing and encapsulation applications. The...

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Oct 4, 2016 | Product News

Master Bond Unveils Electrically Conductive, Two component Silicones for Bonding Applications

Master Bond has developed MasterSil 973S-LO, an adhesive, sealant and coating that passes NASA low outgassing tests. This electrically conductive, two component silicones can be used in the...

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