TAGS: Hot-melt Adhesives
Bostik will present about the compostable packaging market and its new compostable hot melt adhesive at this year’s PACK EXPO September 23-25, 2019 in the Las Vegas, NV convention center.
HMAs for Improving End-of-Package Life
This year, Bostik’s Converted Goods Market Manager, Tyler Derus, will present Avoiding the Landfill: Compostable Hot Melt Adhesives for Sustainable Packages at the Innovation Stage, PACK EXPO’s educational track for industry break throughs and best practices.
Those who attend will learn where the compostable market is heading, how packaging substrates are changing and when compostable products make sense for their applications. Additionally,
Bostik will reveal its latest innovation, a compostable hot melt adhesive that further improves end-of-package life.
Important Step Towards Sustainable Packaging
Speaking in advance of the presentation, Tyler said, “
We are seeing a major shift in the packaging market where consumers are increasingly aware of what they are sending to the landfill. We believe our compostable hot melt is in an important step towards enabling better end of life solutions for packaging. I’m looking forward to the knowledge exchange, and I hope many industry collaborators will find value in the talk.”
Be sure to join Bostik’s Innovation Stage presentation on Tuesday, September 24 from 12 – 12:30 p.m., and stop by booth LS-5846 to learn how Bostik’s solutions make sustainable packaging easier to achieve.
A PMMI show co-located with Healthcare Packaging Expo, PACK EXPO brings together over 30,000 professionals from all verticals of the packaging industry worldwide. In addition to offering complimentary educational sessions focused on the evolving market, trends and challenges, PACK EXPO will host more than 2,000 exhibitors featuring the latest advancements in package assembly.
Source: Bostik