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Bostik Launches BPA- & GLYMO-free PU Adhesives for Food Contact Packaging

Published on 2019-09-24. Edited By : SpecialChem

TAGS:  Solvent borne Adhesives     Polyurethane Adhesives    

GLYMO-free-packaging

Bostik has launched new laminating PU adhesives free of GLYMO and other substances of concern.


Bostik has already developed a GLYMO-free array of one- and two-component laminating polyurethane (PU) adhesives for food contact packaging.

The product line includes both solvent-based and solvent-free technologies for a wide range of applications, from general use to high performance.

Bostik’s product range also does not contain:


  • BPA (bisphenol A)
  • Epoxy resins
  • Phthalate plasticizers
  • O-phthalic acid or tin compounds

These substances are currently categorized as substances of concern in food packaging.

UHP 150 Modular System & Purbinder Hardners


This product line includes newly developed adhesives for high-performance packaging laminates, such as a product exclusively designed for high chemical resistance and the UHP 150 modular system.

The modular system can be combined with three different hardeners to fit various market requirements:

  • Purbinder C1, it creates an aromatic system that is suitable for pasteurization, retort, cold-forming and general usage for mid- to high-performance laminates.
  • Purbinder C10, it creates an aliphatic system, which means it is PAA (primary aromatic amine) free and offers yellowing resistance. It is suitable for pasteurization, retort and cold-forming, and for curing with a climatic chamber.
  • Purbinder CX, it creates an aliphatic system that is PAA free with yellowing resistance. It is compliant with FDA 177.1390 and suitable for pasteurization, retort and cold forming, and delivers fast cure at room temperature.


Source: Bostik
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