TAGS: Epoxy Adhesives
DELO has launched DELO MONOPOX TC2270, a one-component, heat-cure, thermally conductive and electrically insulating adhesive for power semiconductors. The adhesive retains strength after standardized humidity tests with subsequent reflow cycles. The adhesive offers fast heat transfer and long-term reliable operation of semiconductors in power electronics.
High Thermal Conductivity with Electrical Insulation
DELO MONOPOX TC2270 provides high thermal conductivity of 1.7 W/(m∙K) (measured by the criteria of ASTM D5470) due to ceramic filler aluminum nitride. The thermal conductivity is comparable with silver-filled isotropic conductive adhesives (ICA) with thermal conductivity of ~1.5-2.0 W/(m∙K). The adhesive offers heat dissipation and electrical insulation of assemblies.
DELO MONOPOX TC2270 has compression shear strength of 34 MPa on the FR4 composite material and of 11 MPa on high-performance LCP plastics. The electronic adhesive reaches values of 60 N in the die shear test (1x1 mm² silicon dies on gold surface) when bonding microchips.
The electronic adhesive is designed to ensure that final strength is reached after 90 minutes at a curing temperature of 60°C, to enable bonding of temperature-sensitive assemblies and prevent them from damage caused by excessive curing temperatures. The curing process can be reduced to 15 minutes at 80°C. The adhesive's service temperature range is between -40°C and +150°C.
Source: DELO