Panacol has introduced newly developed structural adhesive Structalit® 8801 T, which cures rapidly at low temperatures. The epoxy adhesive was specially formulated for temperature-sensitive applications in electronics, as well as automotive and aerospace industries.
Panacol Structalit® adhesives are solvent free single or two-component adhesives. They are mostly
based on epoxy resin and can be cured at room temperature or by exposure of heat. Structalit® products are designed for bonding, casting and protecting components in electronic and automotive industry.
- Structalit® 8801T is an all-purpose beige-colored single-component epoxy adhesive developed by Techsil’s partner Panacol. It is ideal for potting electronic components particularly when they are temperature sensitive. Its excellent chemical resistance against oils and fuels also makes it the perfect choice for bonding applications in the automotive and aerospace industry.
- Structalit® 8801T has been successfully used where strong resistance to hot kerosene and brake fluids was needed.
- Structalit® 8801T cures very quickly at low oven temperatures; at 100°C this adhesive will fully cure in only a few minutes. Induction curing processes can be used to cure Structalit® 8801T on ferromagnetic substances.
- Due to its shear thinning properties Structalit® 8801T offers improved flow control and the ability for precise dispensing on components’ surfaces. This adhesive develops high bond strength on ceramics, metals and many plastics.
The surfaces to be bonded should be free of dust, oil, grease or other dirt in order to obtain an optimal and reproducible bond.
Panacol-Elosol GmbH, a member of the global Hoenle group, is an international supplier of adhesives with a broad product range that includes UV curable adhesives, structural adhesives, and conductive adhesives.