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Master Bond Launches Chemical Resistant Epoxy System for Sealing Application

Published on 2020-03-30. Edited By : SpecialChem

TAGS:  Sealants    

Master Bond Launches Chemical Resistant Epoxy System for Sealing-ApplicationMaster Bond has launched EP35SP, a two-part epoxy system for bonding and sealing applications, that provides resistance to many chemicals, such as oils, acids, bases, water, fuels, and petrochemicals. The epoxy system features both a high glass transition temperature (Tg) and a broad service temperature range. The glass transition temperature measures 215-220°C and its serviceability extends from -62°C to +288°C (-80°F to 550°F).

EP35SP – Volume Resistivity with Dimensional Stability


EP35SP has notable dielectric properties with a dielectric constant of 4.5 at 60 Hz and a volume resistivity greater than 1014 ohm-cm. The adhesive bonds well to a wide array of substrates, including metals, several plastics, ceramics, glass and composites. Upon curing, the epoxy system offers low shrinkage and good dimensional stability. The tensile modulus is 550,000-600,000 psi with an overall superior physical strength profile even under adverse environmental conditions.

EP35SP has a paste viscosity, with little to no flow, and can be applied on the vertical surfaces. The mix ratio is easy to use 100 to 50 by weight. The epoxy system has a long working life of 24 to 48 hours. For optimal properties, the recommended cure schedule is 1 hour at 110°C followed by 2-3 hours at 125-150°C, plus a post cure at 175°C for 2-3 hours.

Due to its high-temperature resistance and structural properties, EP35SP may be considered for bonding and sealing in downhole, aerospace, electronics, optical and specialty OEM applications. The product is available in half-pint, pint, quart, gallon, and 5-gallon kits.


Source: Master Bond
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