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Room Temperature Curing Epoxy for Bonding & Sealing Applications: Master Bond

Published on 2017-07-17. Author : SpecialChem

Master Bond EP39MAOHT
Master Bond EP39MAOHT
Master Bond has developed EP39MAOHT, a room temperature epoxy curing system. The system is used for demanding bonding, sealing, coating, potting and encapsulation applications.

Robert Michaels, vice president of technical support said:

“It is a versatile product that combines convenient handing, good flow, thermal conductivity, electrical insulation and high temperature resistance. Its toughness lessens the chance of stress cracking when thermally cycled and its low exotherm makes it particularly useful for mid-to-large sized potting applications.”

Properties of EP39MAOHT


  • EP39MAOHT has a low mixed viscosity of 3,000-6,000 cps 
  • A convenient one to one mix ratio by weight 
  • A long working life of 120-150 minutes for a 100 gram batch.

This dimensionally stable system bonds well to a wide variety of substrates including metals, ceramics, composites, glass as well as many rubbers and plastics. It features very low shrinkage upon curing.

Features of this Formulation


This formulation features reliable thermal conductivity of 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m•K)]. The formulation retains superior electrical insulation properties, including:
  • A volume resistivity of >1014 ohm-cm 
  • A dielectric constant of 4.8 at 60 Hz. 
  • It offers chemical resistance to water, fuels and hydraulic fluids as well as many acids and bases.
  • EP39MAOHT is serviceable from -100°F to +400°F. 

The above mentioned performance properties make it suitable for following applications:
  • Aerospace
  • Electronics
  • Electrical
  • Optical 
  • Specialty OEM industries.

EP39MAOHT is off-white in color and is available for use in 1/2 pint, pint, quart, gallon and 5 gallon container kits.

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Source: Master Bond
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