TAGS: Epoxy Adhesives
Master Bond EP3UF-1 is a new single component epoxy that is not premixed and frozen. Due to its low viscosity of 5,000-15,000 cps, this heat curable thixotropic compound is ideal for underfill and many bonding applications.
Master Bond EP3UF-1: One Compound, Multiple Characteristics
EP3UF-1 delivers high bond strength and dimensional stability with a compressive strength of 18,000-20,000 psi and a tensile modulus of 450,000-500,000 psi.
EP3UF-1 has a thermal conductivity of 9-10 BTU in/ft2 hr °F [1.30-1.44 W/(mK)], making it an effective thermal interface material. It contains special filler with a small particle size. This allows it to be applied in bond lines as thin as 10-15 microns imparting a low thermal resistance of 5-7 x 10-6 Km2/W.
It offers superior electrical insulation with a low dielectric constant of 4.5 at 60 Hz as well as a high dielectric strength of 450 volts/mil (for 1/8” thick test specimen), both measured at 75°F.
Easy Storage and Fast Curing
As a single component system, EP3UF-1 is more convenient to handle, apply and store than typical two component adhesive systems.
It has an unlimited working life at room temperature and cures in 20-30 minutes at 250°F, or in 10-15 minutes at 300°F. EP3UF-1 is available for use in 10 cc syringes and 30 cc syringes, which are compatible with automated dispensing systems.
Source: Master Bond