TAGS: Epoxy Adhesives
Sun Chemical has launched EPICLON® HP 4770, a multi-functional naphthalene epoxy resin for formulators and engineers in the aerospace, transportation and electronics industry who seek to increase high temperature performance.
EPICLON HP 4770® Fulfilling Multiple Requirements
Electronic miniaturization and increasing requirements on fiber reinforced structures in the aerospace and transportation industries continue to push operating temperature requirements higher.
EPICLON HP 4770® offers a solution to that challenge while also providing:
- High modulus/stiffness
- Low water absorption
- Improved mechanical properties
- Adhesion
- Good fiber wet out
All critical factors to success in applications ranging from printed circuit boards, encapsulants and lightweighting for aerospace and automobile applications.
Applicable for Various Applications
EPICLON HP 4770® is well suited for:
- Adhesives
- Prepreg manufacturing
- Molding compounds
- Pultrusion
- Resin infusion
It has no restrictions from important regulations, such as the Toxic Substances Control Act in the United States or REACH in Europe.
“
Our customers are looking for resins that can significantly boost the glass transition temperature of advanced materials structures,” said Mark Edwards, Global Key Account Manager of Epoxy, Composites & Fiber Sizing, Sun Chemical Advanced Materials.
“Our new EPICLON HP 4770® takes the temperature performance to a new level. Synthesis of the new epoxy resin yielded the desired results our customers are looking for and confirmed that the critical compressive strength of a structure is related to the resin modulus. The naphthalene unit ratio is key to this strength as well as functionality control. It is an exciting push forward for our customers.”
Source: Sun Chemical