The Universal Selection Source: Adhesives Ingredients

May 16, 2017 | Product News

Master Bond Develops Two Component, Low Viscosity Epoxy for Potting Small Components

Master Bond has developed EP62-1BF, a two part epoxy featuring the ability to withstand exposure to aggressive chemicals. EP62-1BF is easy to handle with a long open time of 12-24 hours at 75°F for...

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Feb 21, 2017 | Product News

Master Bond Develops Low Viscosity Epoxy for Potting and Encapsulation

Master Bond has developed EP30LP-2, a two component epoxy with a low viscosity and a volume resistivity of over 1014 ohm-cm, making it well suited for potting and encapsulation applications. This...

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Dec 20, 2016 | Product News

Master Bond Unveils High-temperature Resistant Epoxy

Master Bond has developed EP46HT-2AO Black. This two component system blends thermal stability with a high strength profile for a variety of bonding, sealing and encapsulation applications. The...

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Oct 4, 2016 | Product News

Master Bond Unveils Electrically Conductive, Two component Silicones for Bonding Applications

Master Bond has developed MasterSil 973S-LO, an adhesive, sealant and coating that passes NASA low outgassing tests. This electrically conductive, two component silicones can be used in the...

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Aug 25, 2016 | Product News

Master Bond Unveils Two Part, Nickel Conductive Epoxy

Master Bond has unveiled EP21TDCN-LO, an electrically conductive two component adhesive/sealant that is particularly effective for grounding, shielding and static dissipation applications. It is a...

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Mar 24, 2017 | Product News

Master Bond Develops One Part, Toughened Epoxy System for Dam-and-fill Encapsulation

Master Bond has developed one part epoxy system: Master Bond Supreme 3HTND-2DM for use in the dam-and-fill method for chip-on-board encapsulation. Master Bond Supreme 3HTND-2DM is a rapid curing...

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Jan 31, 2017 | Product News

Master Bond Unveils EP30TC, a 2C Epoxy for Potting & Sealing Applications in Aerospace

Formulated for use in demanding thermal management applications, Master Bond EP30TC is a two component epoxy that contains robust thermally conductive filler with very fine particle sizes. This NASA...

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Nov 22, 2016 | Product News

Master Bond Develops X5TC, a One Component Elastomeric System

Master Bond has developed Master Bond X5TC, an elastomeric system for bonding & sealing applications in aerospace, electronics & specialty OEM applications. This compound is suitable for bonding...

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Sep 13, 2016 | Product News

Master Bond Formulates Optically Clear, Room Temperature Curing Epoxy

Master Bond has developed EP30-2LB, an optically clear and a two part system with a refractive index of 1.55. It is formulated for specific optical applications, Master Bond EP30-2LB blocks UV light...

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Aug 2, 2016 | Product News

Master Bond Formulates a Solvent Resistant Adhesive for Tamper Proofing Applications

Formulated for bonding, sealing, coating and encapsulation applications, Master Bond EP41S-5 is a room temperature curing epoxy that combines a high strength profile, superior electrical insulation...

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Hartwig Lohse
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Thursday Jun 22 2017

By Hartwig Lohse

Reach faster the same level of efficiency to formulate structural adhesives, which one achieves after years of experience. Learn from a seasoned formulator who understands what issues you're facing as he has been there before.

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