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Patent

Methods And Apparatuses For Assessing High Temperature Bonding Systems And Bonded Substrates Therefrom


Application Date:
May 11, 2017
USPTO Patent:
US 15344530
Abstract:

Methods and apparatuses for assessing the behavior of high temperature bonding systems such as sinter joint models of virtual interconnect microstructures via simulations that analyze sinter joint model properties i...

Inventors:
Hannes Martin Hinrich Greve, Hyattsville MD (US)
F. Patrick McCluskey, Ellicott City MD (US)
Shailesh N. Joshi, Ann Arbor MI (US)
International Classification:
G06F 17/50 (20170511); B23K 1/19 (20170511); B22F 3/10 (20170511); B23K 31/02 (20170511)

Claims

What is claimed is:

1. A method for assessing an interconnect microstructure of a virtual assembly of a high temperature bonding of substrates, the method comprising: defining, by a processor, a plurality of sinter joint objects in the interconnect microstructure of the virtual assembly, each sinter joint object of the plurality of sinter joint objects...

Description

CROSS REFERENCE TO RELATED APPLICATIONS

The present specification claims priority to U.S. Provisional Patent Application Ser. No. 62/252,158, filed Nov. 6, 2015, and entitled METHODS AND APPARATUSES FOR ASSESSING HIGH TEMPERATURE BONDING SYSTEMS AND BONDED SUBSTRATES THEREFROM, the entirety of which is incorporated by reference herein.

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