The Universal Selection Source: Adhesives Ingredients

Patent

Methods And Apparatuses For High Temperature Bonding Controlled Processing And Bonded Substrates Formed Therefrom


Application Date:
Mar 26, 2015
USPTO Patent:
US 14398996
Abstract:

The present invention relates to a sealing device (1) comprising a barrier layer (2) and an adhesive layer (3), and which is suitable for sealing bases in the building sector. The adhesive layer comprises a polymer ...

Inventors:
Herbert Ackermann, Tann (CH)
Matthias Gössi, Uster (CH)
Frank Hoefflin, Baden (CH)
Stefan Keiser, Schwarzenberg (CH)
Roman Rohrer, Sarnen (CH)
Jean-Claude Rudolf, Horw (CH)
International Classification:
B32B 37/18 (20150326); B32B 37/12 (20150326); C09J 7/02 (20150326); C09J 131/04 (20150326); C09J 123/06 (20150326); C09J 123/12 (20150326); C09J 123/08 (20150326); C09J 5/06 (20150326); C09J 123/16 (20150326)
US Classification:
428/3173; 428/355 AC; 428/355 EP; 428/523; 156/ 60

Claims

What is claimed is:

1-15. (canceled)

Description

TECHNICAL FIELD

The invention relates to the field of sealing substrates and bases, in particular in the construction field.

> Search in our Patent Database of 9,919 Patents

Online Course

Edward M. Petrie
0 Days left to register

Thursday Mar 30 2017

By Edward M. Petrie

Avoid premature bond failure when bonding dissimilar materials (LSE plastics, metal, composites, ceramics…) by learning how to efficiently manage the problem of internal stress and cure shrinkage.

Read More
Channel Alerts

Receive weekly digests on hot topics

Receive your alerts

Back to Top