The Universal Selection Source: Adhesives Ingredients


Methods And Apparatuses For High Temperature Bonding Controlled Processing And Bonded Substrates Formed Therefrom

Application Date:
Mar 26, 2015
USPTO Patent:
US 14398996

The present invention relates to a sealing device (1) comprising a barrier layer (2) and an adhesive layer (3), and which is suitable for sealing bases in the building sector. The adhesive layer comprises a polymer ...

Herbert Ackermann, Tann (CH)
Matthias Gössi, Uster (CH)
Frank Hoefflin, Baden (CH)
Stefan Keiser, Schwarzenberg (CH)
Roman Rohrer, Sarnen (CH)
Jean-Claude Rudolf, Horw (CH)
International Classification:
B32B 37/18 (20150326); B32B 37/12 (20150326); C09J 7/02 (20150326); C09J 131/04 (20150326); C09J 123/06 (20150326); C09J 123/12 (20150326); C09J 123/08 (20150326); C09J 5/06 (20150326); C09J 123/16 (20150326)
US Classification:
428/3173; 428/355 AC; 428/355 EP; 428/523; 156/ 60


What is claimed is:

1-15. (canceled)



The invention relates to the field of sealing substrates and bases, in particular in the construction field.

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