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Methods And Apparatuses For High Temperature Bonding Controlled Processing And Bonded Substrates Formed Therefrom

Application Date:
May 11, 2017
USPTO Patent:
US 15344532

Methods and apparatuses for controlled processing of high temperature bonding systems via devices to control heating and cooling systems of a high temperature heating bonding includes use of a sinter fixture device ...

Hannes Martin Hinrich Greve, Hyattsville MD (US)
F. Patrick McCluskey, Ellicott City MD (US)
Shailesh N. Joshi, Ann Arbor MI (US)
International Classification:
B23K 1/00 (20170511); H01L 23/00 (20170511); B23K 35/26 (20170511); C22C 13/00 (20170511); B23K 3/08 (20170511); B23K 3/047 (20170511)


What is claimed is:

1. A sinter fixture device for use in a controlled processing of high temperature bonding of substrates, the sinter fixture device comprising: a base body comprising a metal that is at least one of copper and aluminum;a plate surface that is shaped to contact and conform to a contacting surface of...



The present specification claims priority to U.S. Provisional Patent Application Ser. No. 62/252,166, filed Nov. 6, 2015, and entitled METHODS AND APPARATUSES FOR HIGH TEMPERATURE BONDING CONTROLLED PROCESSING AND BONDED SUBSTRATES FORMED THEREFROM, the entirety of which is incorporated by reference herein.

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