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Patent

THIN PLATE BONDING METHOD AND THIN PLATE ASSEMBLY


Application Date:
May 11, 2017
USPTO Patent:
US 15319256
Abstract:

The present invention relates to a thin plate bonding method or a thin plate assembly, and more particularly, to a thin plate bonding method which includes coating with a coating material after increasing a surface ...

Inventors:
Jong-Soo PARK, Daejeon (KR)
Kyung-Ran HWANG, Daejeon (KR)
Dong-Wook LEE, Daejeon (KR)
Ju-Seok PARK, Daejeon (KR)
Chun-Boo LEE, Daejeon (KR)
Sung-Wook LEE, Daejeon (KR)
Duck-Kyu OH, Daejeon (KR)
Jin-Woo PARK, Daejeon (KR)
Min-Ho JIN, Daejeon (KR)
International Classification:
B23K 20/02 (20170511); B24C 1/10 (20170511); B23K 20/24 (20170511)

Claims

What is claimed is:

1. A thin plate bonding method through lamination and bonding of two or more thin plates, comprising: a roughness increasing process of increasing a surface roughness of at least one of surfaces of two or more thin plates facing each other;a coating process of coating the above surface with metal or...

Description

TECHNICAL FIELD

The present invention relates to a thin metal plate bonding method and a thin plate assembly, and more particularly, to a bonding method including coating with a coating material after increasing a surface roughness, or coating with a microtine material to increase the surface roughness, so as to ensure air...

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