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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients

Polyimides

Polyimides are expensive resins that are hot cured and show excellent thermomechanical properties. Polyimide adhesives retain their mechanical properties at temperatures as high as 250 degrees. They are primarily used in aerospace and military applications as high temperature adhesives. Condensation polyimides, thermoplastic polyimides and imide prepolymers are three main classes of polyimide resins used in adhesives and sealants.
Product Name
Supplier
Description
Lapox® ARBMI-11 by Atul is a pure bismaleimide resin in powder form. Exhibits excellent mechanical properties at ambient & elevated temperature, good humidity resistance, toughness with DABA and... view more
Applications
  • Adhesives
Matrimid® 5218 by Huntsman is a soluble thermoplastic polyimide powder. Possesses very high glass transition temperature and excellent high temperature properties for use in structural composites... view more
Applications
  • Adhesives
  • Transportation (excl. Automotive)>Rail
  • Electrical & Electronic Bonding>Thermally & Electrically conductive
  • Transportation (excl. Automotive)>Aircraft & Aerospace
  • ...
Diamine, 5(6)-amino-1-(4' aminophenyl)-1,3,-trimethylindane. It is a micropulverized version of Matrimid® 5218. Soluble polyimide. Fully imidized polymer. Does not require high temperatures for... view more
Applications
  • Adhesives
Industrial Summit Technology
Straight, n-methyl-2-pyrrolidone, polyimide solution. Used in adhesives. Provides high thermal stability, radiation, solvent and cryogenic resistance, electrical properties and very low tendency to... view more
Applications
  • Adhesives
Industrial Summit Technology
Polyimide solution. Used in adhesives. Provides high thermal stability, radiation, solvent and cryogenic resistance, electrical properties and very low tendency to give off volatile compounds... view more
Applications
  • Adhesives
Industrial Summit Technology
Low viscosity polyimide solution. Used in adhesives. Provides high thermal stability, radiation, solvent and cryogenic resistance, electrical properties and very low tendency to give off volatile... view more
Applications
  • Adhesives
Industrial Summit Technology
BTDA/MDA based aromatic polyimide solution. Used in adhesive formulations. Provides high thermal stability, radiation and solvent resistance, electrical properties, very good radar transparency and... view more
Applications
  • Adhesives
Industrial Summit Technology
BTDA/MDA based aromatic polyimide solution. Used in structural laminates and film adhesives. Provides high thermal stability, radiation and solvent resistance, electrical properties, very good radar... view more
Applications
  • Adhesives
Industrial Summit Technology
MDA free, aromatic polyimide solution. Used in structural laminates and film adhesives. Provides high thermal stability, radiation and solvent resistance, electrical properties, very good radar... view more
Applications
  • Adhesives
Industrial Summit Technology
MDA free, aromatic polyimide solution. Used in formable powder for rigid PI foam. Provides high thermal stability, radiation and solvent resistance, electrical properties, very good radar... view more
Applications
  • Adhesives
  • Sealants>Foam
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