Energy savings plus mechanical reinforcement and rheology control

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Resicure™ EMI-24

Technical Datasheet | Supplied by A&C Catalysts

Resicure™ EMI-24 by A&C Catalysts is a 2-ethyl-4-methylimidazole. It is used as a sole curing agent or as a dicy and anhydride cure accelerator in epoxy resin based formulations. Offers high chemical resistance, high glass transition temperature and rapid reactivity at temperature less than 100°C with 9-12 hours latency. Resicure™ EMI-24 is used in electrical potting and encapsulation, one-component adhesives for electronics applications. Typical loading level as a sole curing agent in epoxy resin (EEW=190)is about 1-5 phr and as a dicy and anhydride cure accelerator is about 0.5 – 3.0 phr.

Compatiblity with other products

Find products that are predicted to be compatible with Resicure™ EMI-24.

This list of compatible products is generated out of estimated HSP values. A practical determination of these HSP values would provide higher certainty.
Learn more about Hansen Solubility Parameters (HSP) and their use in predictive formulation.

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Compatible Products Based on HSP Distance

HSP distance provides an indication of compatibility. It is based upon the “like seeks like” principle. The smaller the distance between ingredients, the more compatible they are predicted to be.

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