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Omicure® DDA 100

Technical Datasheet | Supplied by Huntsman
Omicure® DDA 100 by Huntsman is coarse, unground grade of Dicyandiamide, a solid latent curing agent for epoxy resins. It is primarily designed for use in solvent-based compositions. Omicure® DDA 100 is used in one component, prepregs and film adhesives and electronic potting and encapsulting compounds.
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Product Type
Crosslinking / Curing / Vulcanizing Agents > Amines /Amides > Dicyandiamides
Chemical Composition
Dicyandiamide
CAS Number
461-58-5
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