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Adhesives Ingredients
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Adhesives Ingredients
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Omicure® U-24M

Technical Datasheet | Supplied by Huntsman
Omicure® U-24M by Huntsman is an aromatic substituted urea, intended for use as a latent accelerator for the dicyandiamide cure of epoxy resins. It is suitable for encapsulation adhesives. The addition of Omicure® U-24M to epoxy/ dicy formulations reduces the time and/or temperature required to cure these shelf stable one part products. Suggested use level is < 5 phr.
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Product Type
Catalysts / Accelerators / Initiators
Chemical Composition
2,4’-Toluene bis dimethyl urea
CAS Number
17526-94-2

Compatiblity with other products

Find products that are predicted to be compatible with Omicure® U-24M.

This list of compatible products is generated out of estimated HSP values. A practical determination of these HSP values would provide higher certainty.
Learn more about Hansen Solubility Parameters (HSP) and their use in predictive formulation.

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