HP 100205

Technical Datasheet | Supplied by Hitech Industries

Reactive polyamide. Acts as a cuing agent. Exhibits low viscosity. Used in combination with liquid epoxy for cold curing/ambient temperature. Suitable for concrete adhesives. Recommended loading of liquid epoxy EEW-200 is 58.0-60.0 pph.

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Product Type

Crosslinking / Curing / Vulcanizing Agents > Amines /Amides > Polyamines

Chemical Composition

Reactive polyamide

Product Status

COMMERCIAL

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