HyComp® 500

Technical Datasheet | Supplied by HyComp

Benzoxazine resin. Used in adhesives and sealants. Provides easy processing and long-term operation up to 450°F. Co-cures with epoxies, phenolics, and polyamine. Offers fast cure, no shrinkage and great thermal stability.

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Product Type

Aminoplastes / Phenoplastes (UF, MUF)

Chemical Composition

Benzoxazine

Physical Form

Various

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Industries Served

Plastics
Elastomers

Coatings
Ingredients

Adhesives
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Cosmetics
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Polymer
Additives

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