The Universal Selection Source: Adhesives Ingredients
FTIR made Easy for Better Identification of Plastics
Aug 31, 2016
More info and registration
Water-based film inks: Advanced Formulation
Sep 1, 2016
Pigment Dispersion & Stabilization in Practice
Sep 6, 2016
Hot melt Adhesives
Solvent borne Adhesives
UV/EB Cure Adhesives
Technical DataSheet | Supplied by
Dispersible, random copolymer of butene-1 with high ethylene content. Used as a blend component in hot melt adhesives (HMA) formulations and sealant compounds. Increases open time. Maintains mechanical integrity at higher temperatures. Can be used in combination with a wide variety of non-polar resins and waxes. Offers highly compatibility with polypropylene. Provides good abrasion and chemical resistance, good flexibility and good toughness.
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