The Universal Selection Source: Adhesives Ingredients
This technology estate comprises patents that all share one aspect, they are made to be biodegradable.
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More info and registration
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Hot melt Adhesives
Solvent borne Adhesives
UV/EB Cure Adhesives
Technical DataSheet | Supplied by
Dispersible, random copolymer of butene-1 with high ethylene content. Used as a blend component in hot melt adhesives (HMA) formulations and sealant compounds. Increases open time. Maintains mechanical integrity at higher temperatures. Can be used in combination with a wide variety of non-polar resins and waxes. Offers highly compatibility with polypropylene. Provides good abrasion and chemical resistance, good flexibility and good toughness.
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