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Adhesives Ingredients
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Adhesives Ingredients
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HRJ 10518

Technical Datasheet
Heat-reactive octylphenol-formaldehyde resin. Provides a rapid cure at normal curing temperatures and adequate cure at lower temperatures. Used to formulate pressure sensitive adhesives. Compatibility with butyl, natural, nitrile, polychloroprene, EPDM and other elastomers.
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Product Type
Aminoplastes / Phenoplastes (UF, MUF) > Phenol Formaldehydes
Chemical Composition
Octylphenol - formaldehyde
Physical Form
Flakes
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