DESMOPHEN® 1150 by Covestro is a solvent-free, branched polyol with ester and ether groups. It can be combined with DESMODUR® L to formulate highly resistant sealing compouunds... view more

Linear polypropylene polyether polyol. Used in solvent based footwear and automotive adhesives. Shows thinning with solvents such as aromatics, ketones and esters... view more

Branched polypropylene ether polyol containing tertiary amine groups. Used in solvent based footwear and automotive polyurethane adhesives. Shows thinning with solvents such as aromatics, ketones... view more

Polyether polyol. Used in solvent free or low solvent polyurethane adhesives and sealants. Shows thinning with solvents such as aromatics, ketones and esters... view more

Tetrafunctional polyether polyol containing tertiary amine groups. Used in solvent free reactive adhesives for footwear and automotive. Shows thinning with solvents such as aromatics, ketones and... view more

Krasol® F 3000 by Cray Valley (Total Group) is polyfarnesene diol. It is based on trans-ß-farnesene, a renewable alternative to petroleum-based feedstocks such as butadiene. It provides lower... view more

Linear polybutadiene polymer with hydroxyl end groups. Possesses excellent chemical resistance, good electrical characteristics, good low temperature properties, hydroxyl functionality and narrow... view more

Linear polybutadiene polymer with hydroxyl end groups. Possesses excellent chemical resistance, good electrical characteristics, good low temperature properties, hydroxyl functionality and narrow... view more

Linear polybutadiene polymer with primary hydroxyl groups. Possesses excellent chemical resistance, good electrical characteristics, good low temperature properties, hydroxyl functionality and... view more

Linear polybutadiene polymer with primary hydroxyl groups. Possesses excellent chemical resistance, good electrical characteristics, good low temperature properties, hydroxyl functionality and... view more

Bisphenol F type epoxy resin. It is a liquid resin having excellent workability and moldability due to low viscosity. Applications include concrete adhesives... view more

EPICLON® 830-S by DIC Corporation is Bisphenol-F based epoxy resin. It contains low hydrolyzable chlorine content. Exhibits excellent workability and moldability due to low viscosity. EPICLON® 830-S... view more

Bisphenol F type epoxy resin. It has low tendency for crystallization. Exhibits excellent workability and moldability due to low viscosity. Applications include concrete adhesives... view more

EPICLON® 840 by DIC Corporation is a low viscosity bisphenol A type (BPA) epoxy resin. Available in Asian countries. Applications of EPICLON® 840 by DIC Corporation include concrete adhesives... view more

Bisphenol A type (BPA) epoxy resin. It is a liquid resin comprising low hydrolyzable chlorine. Available in Asian countries. Applications include concrete adhesives... view more

Haloflex™ 202 by DSM is vinyl acrylic copolymer latex designed for water-based adhesives. It has good barrier properties to water vapor, oxygen, carbon dioxide and radon are required. Haloflex™ 202... view more

Alicyclic epoxy resin. Used in insulating sealants for semiconductors and transparent insulating sealants for optoelectronics such as light-emitting diode. Offers low viscosity, no halogen... view more

Good reactivity, alicyclic epoxy resin. Used in insulating sealants for semiconductors and transparent insulating sealants for optoelectronics such as light-emitting diode. Offers low viscosity, no... view more

Highly reactive, alicyclic epoxy resin. Used in insulating sealants for semiconductors and transparent insulating sealants for optoelectronics such as light-emitting diode. Offers low viscosity, no... view more

2-Ethylhexyl Acrylate, 15 ppm MEHQ by Dow is readily polymerized. 2-Ethylhexyl Acrylate, 15 ppm MEHQ is used in pressure sensitive adhesives... view more

Butyl Acrylate, 15 ppm MEHQ by Dow is used in adhesives... view more

DOWSIL™ 2013 Adhesive by Dow is solvent-free silicone pressure sensitive adhesive. It offers fast curing and low oven dusting. DOWSIL™ 2013 Adhesive imparts very good low temperature... view more

DOWSIL™ 282 by Dow is a dispersion of polydimethylsiloxane gum and resin. It is suitable for many bonding, fastening or holding applications. DOWSIL™ 282 is used for presssure sensitive adhesives... view more

DOWSIL™ 3055 Resin by Dow is a reactive amine functional silicone blending resin used as a crosslinker. It exhibits gloss retention, water absorption and thermal stability. It provides gloss... view more