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Adhesives Ingredients
The material selection platform
Adhesives Ingredients

Epoxy Adhesives

Epoxy adhesives are thermosetting resins which solidify by polymerization and, once set, will soften but not melt on heating. Two-part resin/hardener epoxy systems solidify on mixing (sometimes accelerated by heat), while one-part epoxy adhesives require heat to initiate the reaction of a latent catalyst.

Explore advancements in the new structural epoxy adhesives (high lap shear strength at sub-ambient temperature, toughness and high hot/wet glass transition temperature Tg retention…).

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Jan 11, 2021 | Product News

Master Bond Launches Electrically Insulative Epoxy for Sealing Applications

Master Bond launches Master Bond EP21NS, a two-part epoxy used for bonding, coating, sealing and potting/encapsulating. The epoxy has a nanosilica filler that imparts dimensional stability and...

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Dec 29, 2020 | Industry News

New Magnetic Field-activated Glue Saves on Energy and Time

Scientists from Nanyang Technological University, Singapore, have developed a new way to cure adhesives using a magnetic field. The new “magnetocuring” adhesive is made by combining a typical...

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Dec 9, 2020 | Industry News

Huntsman to Acquire Gabriel Performance Products to Expand Chemicals Business

Huntsman Corporation to acquire Gabriel Performance Products, a North American specialty chemical manufacturer of specialty additives and epoxy curing agents for the coatings, adhesives, sealants...

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Dec 2, 2020 | Industry News

Sika Builds New Epoxy Resins Manufacturing Facility in UAE

Sika expands its production capacity in the United Arab Emirates with the commissioning of a new manufacturing facility in Dubai to produce epoxy resins for its flooring adhesive solutions...

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Dec 1, 2020 | Product News

ThreeBond Introduces Induction-curable Epoxy Adhesive for Bonding Applications

ThreeBond launches ThreeBond 2273E, a heat curing, one component epoxy adhesive without solvent. The easy-to-use adhesive is developed for the instant induction curing and is ideal for bonding and...

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Nov 10, 2020 | Product News

Master Bond’s New Low-cure Thermally Conductive Epoxy Adhesive for Electronics

Master Bond launches Master Bond EP4EN-80, a NASA low outgassing approved epoxy adhesive for bonding and small encapsulation applications. The epoxy can be cured at temperatures as low as 80°C...

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Nov 9, 2020 | Product News

DELO Launches Liquid Acrylic- and Epoxy-based PSAs for the Electronics Industry

DELO launches two liquid pressure-sensitive adhesives DELO PHOTOBOND PS4130 and DELO KATIOBOND PS6372, for the electronics industry. The adhesives have similar properties to (double-sided) adhesive...

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Nov 5, 2020 | Industry News

Lightweight End-products to Drive Composite Adhesive Market Growth: GVR

Grand View Research anticipates that the global composite adhesive market will reach USD 4.41 billion by 2027, expanding at a CAGR of 3.9 percent from 2020 to 2027, during the forecast period...

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Nov 5, 2020 | Industry News

Researchers Use Tree Bark to Develop BPA-free Epoxy Resin for Adhesives

Researchers from University of Toronto have developed bisphenol A (BPA) free epoxy resin, using tree bark, for making industrial strength adhesives. One of the key chemical building blocks of...

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Oct 28, 2020 | Industry News

Electronic & Automotive Sectors to Drive A&S Market for Manufacturing Industry

In terms of value, Transparency Market Research (TMR) anticipates that the global adhesives and sealants market for manufacturing industry is expected to cross USD 33.3 Bn by 2030, expanding at a...

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