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Apr 25, 2022 | Industry News
Fortune Business Insights (FBI) anticipates that the adhesives & sealants market is projected to grow from USD 62.64 billion in 2021 to USD 87.47 billion in 2028 at a CAGR of 4.9% during the...
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Apr 21, 2022 | Industry News
Research and Markets (RM) anticipates that the adhesives & sealants market is projected to grow from USD 71.4 billion in 2021 to USD 85.8 billion by 2026, at a CAGR of 3.7% between the 2021 and 2026...
Apr 20, 2022 | Industry News
LANXESS will be showcasing its extensive product range for the design of reactive hot-melt systems and share new insights in the innovative low-free (LF) monomer technology at WAC 2022. Existing and...
Feb 23, 2022 | Industry News
Arkema is expanding its offer of engineering adhesives with the planned acquisition of Shanghai Zhiguan Polymer Materials (PMP), which specialized in hot-melt adhesives for the consumer electronics...
Sep 24, 2021 | Industry News
In terms of revenue, Transparency Market Research (TMR) anticipates that the masking tapes market in India is expected to reach a valuation of USD 350.5 million by 2031 and is estimated to expand at...
Aug 16, 2021 | Industry News
Research and Markets (RM) anticipates that the global reactive & other adhesives market is expected to grow from 6.47 billion USD in 2020 to 6.72 billion USD in 2021 at a compound annual growth rate...
Jul 27, 2021 | Industry News
H.B. Fuller has announced a strategic partnership with Covestro to deliver an adhesive with a reduced climate impact for the woodworking, composites, textiles and automotive industries...
Jun 16, 2021 | Industry News
Henkel presented its apparel adhesive solutions in the 16th Shenzhen International Brand Underwear Fair (SIUF). SIUF provides a platform to showcase their cutting-edge products and R&D progress...
Jun 15, 2021 | Industry News
COIM, an Italian multinational specialty chemicals manufacturer has acquired a controlling stake in the Spanish company Neoflex. Neoflex specializes in one-, two-component and reactive hot melt...
Jun 7, 2021 | Industry News
Henkel’s low-pressure molding technology for encapsulating electrical and electronic components in its Technomelt polyamide adhesive molding compounds is being adopted for medical, electronic...