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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients

2K Epoxy for Bonding PVC and Other Difficult to Bond Plastics (B)

Adhesives Formulation

Applicable Base Polymer

Applicable Base Polymer Properties

Because of their thermosetting molecular structure, epoxy adhesives exhibit excellent tensile-shear strength but poor peel strength unless modified with a more resilient polymer. Epoxy adhesives offer excellent resistance to oil, moisture, and many solvents. Low shrinkage on curing and high resistance to creep under prolonged stress are characteristics of many high quality epoxy adhesives. Epoxy resins have no evolution of volatiles during cure and are useful in gap-filling applications. Polyamide and amido-amines are commonly used room temperature curing agents for epoxy adhesives. They contribute to flexibility and provide moderately fast curing times at room temperature.

Typical Formulation Ingredients

Ingredient
Parts by weight
DGEBA resin (EPON 828, Momentive) 
xx 
CTBN modified bisphenol A resin (EPON 58005, Momentive) 
xx 
Fumed silica (Cab-O-Sil M5) 
x 
Part B: 
 
Amidoamine (EPI-CURE 3055, Momentive) 
xx 

Processing

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Resulting Properties

The formulation above shows moderately flexible epoxy resin formulations that can be used for bonding difficult plastic substrates including PVC. The main problem of bonding to flexible PVC is due to the plasticizer in the compound. Plasticizer migration from the vinyl into the adhesive bondline can degrade the strength of the joint. Adhesives must be tested for their ability to resist the plasticizer. Certain epoxy adhesive formulations such as those above have been found to provide excellent adhesion to flexible PVC substrates.

Tips and Tricks

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