Typical Formulation Ingredients
Phase
Ingredient
Parts by weight
Epoxy Component:
Bisphenol A DGE epoxy resin (Various)
Epoxy Component
Epoxy resin (Epodil 748, Air Products)
Curing Agent Component
Hardener (Anquamine 735, Air Products)
Curing Agent Component
Defoamer (BYK 1770, BYK)
Curing Agent Component
Titanium dioxide (Kronos 2160, Kronos)
Curing Agent Component
Diluent – DI water
Curing Agent Component
Filler (Cimbar 325, Cimbar)
Curing Agent Component
Filler (Sil-Co-Sil 106, US Silica)
Curing Agent Component
Filler, quart sand (approx 150 µm)
Curing Agent Component
Filler, quartz sand (approx 300µm)
Curing Agent Component
Thixotropic agent (Zanthum gum, 3%)
Typical Properties
Shore D hardness, 1 Day at 25° C
Shore D hardness, 7 days at 25°C
Resulting Properties
Waterborne epoxy adhesives can be produced with epoxy emulsions and polyamide-amine curing agents. A typical starting formulation is shown for a self-leveling compound for concrete floors. This formulation can be used as either a coating or an adhesive. In either application, once the mixed emulsion is applied to the substrate the water must be evaporated. In the case of the adhesive application, this must be completed before non-porous substrates are mated. With the particular formulation presented above, the pot life is several hours at room temperature.
The source of 2K Waterborne Epoxy for Self Leveling Floors (A) is Air Products