Typical Formulation Ingredients
Ingredient
Parts by weight
DGEBA epoxy resin (Epon 828, Momentive Specialty Chemicals)
Aluminum Powder 120 (Alcoa – Specialty Metals Division)
Fatty polyamide curing agent (Epikure 3125, Momentive Specialty Chemicals)
(Source: Momentive Specialty Chemicals)
Typical Properties
Mix ratio (Part A to Part B) by weight
Working life at 25°C, one pint, mins
Mixed viscosity at 25° C, poise
• Cured 24 hrs at 23°C, tested at 23°C, psi
• Cured 24 hrs at 23°C, tested at 121°C, psi
• Cured 48 hrs at 23°C, tested at 23°C, psi
• Cured 48 hrs at 23°C, tested at 121°C, psi
Resulting Properties
The formulation above is for an epoxy adhesive that cures at ambient temperatures of 25°C or more and shows very good adhesion to various metal substrates. It also provides some tolerance to trace amounts of lubricants which may remain on substrates when cleaning conditions are not ideal.
Polyamide is a commonly used room temperature curing agent for epoxy adhesives. It contributes to flexibility and provides moderately fast curing times at room temperature.