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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients

Ambient Temperature Cure, 2K, Epoxy for Bonding Metals

Adhesives Formulation

Applicable Type
Applicable Base Polymer

Applicable Base Polymer Properties

Because of their thermosetting molecular structure, epoxy adhesives exhibit excellent tensile-shear strength but poor peel strength unless modified with a more resilient polymer. Epoxy adhesives offer excellent resistance to oil, moisture, and many solvents. Low shrinkage on curing and high resistance to creep under prolonged stress are characteristics of many high quality epoxy adhesives. Epoxy resins have no evolution of volatiles during cure and are useful in gap-filling applications.

Typical Formulation Ingredients

Ingredient
Parts by weight
Part A: 
 
DGEBA epoxy resin (Epon 828, Momentive Specialty Chemicals) 
xxxxx 
Aluminum Powder 120 (Alcoa – Specialty Metals Division) 
xxxxx 
Part B: 
 
Fatty polyamide curing agent (Epikure 3125, Momentive Specialty Chemicals) 
xxxx 
(Source: Momentive Specialty Chemicals) 
 

Typical Properties

Properties
Mix ratio (Part A to Part B) by weight 
xxxxxx 
Working life at 25°C, one pint, mins 
xx 
Mixed viscosity at 25° C, poise 
xxxxxx 
Tensile strength 
 
• Cured 24 hrs at 23°C, tested at 23°C, psi 
xxxx 
• Cured 24 hrs at 23°C, tested at 121°C, psi 
xxx 
• Cured 48 hrs at 23°C, tested at 23°C, psi 
xxxx 
• Cured 48 hrs at 23°C, tested at 121°C, psi 
xxx 

Processing

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Resulting Properties

The formulation above is for an epoxy adhesive that cures at ambient temperatures of 25°C or more and shows very good adhesion to various metal substrates. It also provides some tolerance to trace amounts of lubricants which may remain on substrates when cleaning conditions are not ideal.

Polyamide is a commonly used room temperature curing agent for epoxy adhesives. It contributes to flexibility and provides moderately fast curing times at room temperature.

Tips and Tricks

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