Typical Formulation Ingredients
Phase
Ingredient
Parts by weight
Part A
Epoxy acrylate resin (EPON 8111, Resolution Performance Products)
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Part A
Fumed silica (Cab-O-Sil M5 Silica, Cabot Corp.)
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Part A
Ground quartz (Novacite 1250, Malvern Minerals Co.)
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Part B
Aliphatic amine (EPI-CURE 3271, Resolution Performance Products)
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Part B
Aliphatic amine (EPI-CURE 3270, Resolution Performance Products)
Part B
Fumed silica (Cab-O-Sil M5 Silica, Cabot Corp.)
Part B
Ground quartz (Novacite 1250, Malvern Minerals Co.)
Typical Properties
Mix ratio by weight (Part A:Part B)
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Gel time at 25°C, 100 gm mass
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Bond line gel time
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Tensile shear strength, psi, on etched aluminum:
1 hrs at 25°C
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24 hrs at 25°C
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1 day at 25°C followed by 2 hrs at 100°C
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Resulting Properties
Epoxy polyacrylate adhesives find use where conventional epoxy adhesives are generally used but a fast cure is required. Conventional epoxy resins lack the ability to fully cure at temperature below 10°C. The epoxy polyacrylate resins react readily at low temperature and very rapidly at ambient temperatures.
In addition to their fast cure rates at ambient temperatures and great reactivity at low temperatures, the epoxy polyacrylate adhesives provide other advantageous properties. These include:
- Inherently low viscosity
- Good physical strength and toughness
- Superior wetting characteristics
- Good adhesive properties
- Good film forming properties.
Typical starting formulations for rapid setting, room temperature curing epoxy acrylate adhesive formulations are shown in the above table