Typical Formulation Ingredients
Phase
Ingredient
Parts by weight
Part A
DGEBA epoxy (EEW=190)
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Part A
Reactive diluent (Epodil 748)
Part A
Talc (Microtuff 325F)
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Part A
Fumed silica thixotrope
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Part B
Cycloaliphatic amine (Ancamine 2264)
Part B
Polyamide (Ancamide 910)
Part B
Polyamide (Ancamide 2482)
Part B
Aluminum powder (Toyal 101)
Part B
Talc (Microtuff 32F)
Part B
Fumed silica thixotrope
Typical Properties
Cure schedule
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Mix ratio
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Properties on Aluminium - Lap shear @ 25°C
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Properties on Aluminium - Lap shear @ 120°C
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Properties on Aluminium - T-peel @ 25°C
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Resulting Properties
The table above shows a rigid and flexible general purpose epoxy adhesive formulation. The rigid formulation is generally used where the substrates are also rigid such as metals, glass, ceramics, etc. The flexible formulations is generally used on flexible substrates such as plastics, elastomers, etc.