Typical Formulation Ingredients
Phase
Ingredient
Parts by weight
A
1,4-butanediol diglycidyl ether
B
Phenalkamide curing agent (Cardolite® GX-3090, Cardolite)
C
Silica (Silverbond 602, Sibelco)
Typical Properties
Compressive strength at max, MPa, cured 24 hrs at 60°C
Glass transition temperature, °C
Gel time, min, 250 gm at 25°C
Working time, min, 250 gm at 25°C
Resulting Properties
Because of their thermosetting molecular structure, epoxy adhesives exhibit excellent tensile-shear strength but poor peel strength unless modified with a more resilient polymer. Epoxy adhesives offer excellent resistance to oil, moisture, and many solvents. Low shrinkage on curing and high resistance to creep under prolonged stress are characteristics of many high quality epoxy adhesives. Epoxy resins have no evolution of volatiles during cure and are useful in gap-filling applications.
This aggregate-filled formulation illustrates the use of epoxy resins to impart thermal compatibility with exterior concrete applications including patching of slab and joint spalls, skid-proofing loading docks and ramps, crack sealing and waterproofing, grout bonding of pre-cast concrete supports, and grouting of recessed electrical wiring, posts, tie-down fixtures, etc.