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Adhesives Ingredients
The material selection platform
Adhesives Ingredients

High Strength Epoxy Grout (C) by Cardolite

Adhesives Formulation | Supplied by Cardolite

Applicable Type
Applicable Base Polymer
Applicable Industrial Sectors

Applicable Base Polymer Properties

Cardolite® GX-3090 is a solvent free and very low viscosity phenalkamide epoxy curing agent. Exhibits excellent mechanical properties, faster strength development, and good adhesion at recommended mixing ratio of 35phr. Cardolite® GX-3090 provides very high Tg and excellent compression strength. Suitable for industrial and construction adhesives.

Typical Formulation Ingredients

Phase
Ingredient
Parts by weight
Epoxy resin (EEW=190) 
xx 
1,4-butanediol diglycidyl ether 
xx 
Phenalkamide curing agent (Cardolite® GX-3090, Cardolite) 
xx 
Sand blend (16# / 24# / 40# at a ratio of 70/70/40) + Silverbond 602 
xxx 

Typical Properties

Properties
Compressive strength at max, MPa, cured 24 hrs at 60°C 
xxx 
Glass transition temperature, °C 
xx 
Gel time, min, 250 gm at 25°C 
xx 
Working time, min, 250 gm at 25°C 
xx 
Viscosity 
xxxxxxxx 

Processing

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Resulting Properties

Because of their thermosetting molecular structure, epoxy adhesives exhibit excellent tensile-shear strength but poor peel strength unless modified with a more resilient polymer. Epoxy adhesives offer excellent resistance to oil, moisture, and many solvents. Low shrinkage on curing and high resistance to creep under prolonged stress are characteristics of many high quality epoxy adhesives. Epoxy resins have no evolution of volatiles during cure and are useful in gap-filling applications.

This aggregate-filled formulation illustrates the use of epoxy resins to impart thermal compatibility with exterior concrete applications including patching of slab and joint spalls, skid-proofing loading docks and ramps, crack sealing and waterproofing, grout bonding of pre-cast concrete supports, and grouting of recessed electrical wiring, posts, tie-down fixtures, etc.

Tips and Tricks

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