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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients

High Temperature Epoxy Adhesive

Adhesives Formulation

Applicable Type
Applicable Base Polymer

Applicable Base Polymer Properties

Epoxy adhesives are generally more resistant to a wide variety of liquid environments than other structural adhesives. However, the resistance to a specific environment is greatly dependent on the type of epoxy curing agent used. Anhydride cured systems are frequently preferred for heat resistance.

Typical Formulation Ingredients

Ingredient
Parts by weight
Epoxy resin (EEW = 190) 
xxx 
Benzophenone tetracarboxylic dianhydride (BTDA) 
xx 
Atomized aluminum powder 
xxx 
Fumed silica 
x 

Typical Properties

Properties
Cure conditions 
xxxxxxxxxxxxxx 
Shear strength, psi, on acid etched aluminum tested at: 
 
• 23°C 
xxxx 
• 150°C 
xxxx 
• 260°C 
xxxx 

Processing

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Resulting Properties

Certain epoxy adhesive formulations, however, have been able to withstand short terms at 250°C and long term service at 150-180°C. These systems were formulated specifically for thermal environments by incorporation of stable epoxy coreactants or high temperature curing agents (e.g., anhydrides such as BTDA) into the adhesive. The high temperature properties of an epoxy adhesive formulation cured with BTDA are given in the table above.

Tips and Tricks

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