Energy savings plus mechanical reinforcement and rheology control

High Temperature Epoxy Adhesive (Phenolic Paste)

Adhesives Formulation

Applicable Type

Reactive Adhesives

Applicable Base Polymer

Epoxies (EP)

Applicable Industrial Sectors

Electrical & Electronic Bonding , Aircraft & Aerospace

Applicable Base Polymer Properties

Epoxy-phenolic adhesives are generally used in aerospace applications requiring high shear strength at temperatures in excess of 150°C. Usually the phenolics are a resole-type and often the epoxy is a minor component. These adhesives are relatively brittle and have low peel and impact strengths.

Typical Formulation Ingredients

Ingredient

Parts by weight

DGEBA epoxy resin (mol. wt. 1,000)

xxx

DGEBA epoxy resin (mol. wt. 2,000)

Phenolic resin

Powdered aluminum

xxx

Dicyandiamide

Copper 8-quinolinolate

xxx

Methyl ethyl ketone

Hexamethylenetetramine

(Source: Lee, H. and Neville, K., Handbook of Epoxy Resins, McGraw Hill, New York, 1967, pp. 21.43-44.)

Typical Properties

Properties

Tensile shear strength, psi, on aluminum at:

- 58°C

xxxx

- Room temperature

xxxx

- 159°C

xxxx

- 232°C

- 260°C

xxxx

- 316°C

- At 25°C after 100 cycles 252°-250°C

xxxx

- At 25°C after 200 hrs at 250°C

xxx

Processing

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Resulting Properties

The table above shows a starting formulation for a high temperature epoxy phenolic adhesive (paste and solution). It can be formed into a film by casting from a solvent solution. The adhesive can withstand temperatures up to 287°C.

Tips and Tricks

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