Energy savings plus mechanical reinforcement and rheology control

High Temperature Epoxy – Phenolic Adhesive (Phenolic Solution Coating)

Adhesives Formulation

Applicable Type

Reactive Adhesives

Applicable Base Polymer

Epoxies (EP)

Applicable Industrial Sectors

Electrical & Electronic Bonding , Aircraft & Aerospace

Applicable Base Polymer Properties

Epoxy-phenolic adhesives are generally used in aerospace applications requiring high shear strength at temperatures in excess of 150°C. Usually the phenolics are a resole-type and often the epoxy is a minor component. These adhesives are relatively brittle and have low peel and impact strengths.

Typical Formulation Ingredients

Ingredient

Parts by weight

DGEBA epoxy resin (mol. wt. 1,000)

DGEBA epoxy resin (mol. wt. 2,000)

xxx

Phenolic resin

xxx

Powdered aluminum

Dicyandiamide

Copper 8-quinolinolate

Methyl ethyl ketone

xxx

Hexamethylenetetramine

(Source: Lee, H. and Neville, K., Handbook of Epoxy Resins, McGraw Hill, New York, 1967, pp. 21.43-44.)

Typical Properties

Properties

Tensile shear strength, psi, on aluminum at:

- 58°C

xxxx

- Room temperature

xxxx

- 159°C

- 232°C

xxxx

- 260°C

- 316°C

xxxx

- At 25°C after 100 cycles 252°-250°C

- At 25°C after 200 hrs at 250°C

Processing

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Resulting Properties

The table above shows a starting formulation for a high temperature epoxy phenolic adhesive (paste and solution). It can be formed into a film by casting from a solvent solution. The adhesive can withstand temperatures up to 287°C.

Tips and Tricks

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