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Adhesives Ingredients
The material selection platform
Adhesives Ingredients

Low Viscosity Epoxies for Heat Curable Textile Binder (C) by Momentive

Adhesives Formulation

Applicable Base Polymer
Applicable Industrial Sectors

Applicable Base Polymer Properties

Because of their thermosetting molecular structure, epoxy adhesives exhibit excellent tensile-shear strength but poor peel strength unless modified with a more resilient polymer. Epoxy adhesives offer excellent resistance to oil, moisture, and many solvents. Low shrinkage on curing and high resistance to creep under prolonged stress are characteristics of many high quality epoxy adhesives. Epoxy resins have no evolution of volatiles during cure and are useful in gap-filling applications.

Typical Formulation Ingredients

Phase
Ingredient
Parts by weight
Epoxy resin (Epon 862, Momentive) 
xxx 
Cycloaliphatic amine curing agent (Epikure 3300, Momentive) 
xxxx 

Typical Properties

Properties
Gel time, 100 gm mass, mins 
xxx 
Cure schedule, mins @ °C 
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Glass transition temperatures, °C 
xxx 
Tensile strength, psi 
xxxxx 
Tensile elongation, % 
xxx 
Hardness, Shore D 
xx 
Weight loss, 24 hrs at 150°C 
xxx 

Processing

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Resulting Properties

Epikure 3300 is a very low viscosity, light colored cycloaliphatic amine curing agent for use in formulating heat cured epoxies. As a sole curing agent, EPIKURE Curing Agent 3300 can yield epoxy systems with relatively high heat distortion properties when properly cured. The formulation above shows a rigid epoxy resin formulation that can be used as either a binder or casting compound. The formulation is also often used in the electrical / electronic industry where good electrical insulation characteristics are required.

Source: Momentive

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