The Universal Selection Source: Adhesives Ingredients

Formulation

Polyamide Hot Melt for Metal Bonding and Caulking Compound

Applicable Type
Applicable Base Polymer
Applicable Industrial Sectors

Typical Formulation Ingredients

Phase
Ingredient
Parts by weight
Polyamide resin (Versamid 900, Cognis) 
   
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    Polyamide resin (Versamid 100, Cognis) 
       
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    Typical Properties

    Properties
    Excellent metal-to-metal thermoplastic adhesive and caulking compound 
       
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    Extremely tough and resistant to impact 
       
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    Effectively joins plastics, foils, and papers 
       
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  • Applicable Base Polymer Properties

    Polyamide HMAs have exceptionally high shear strength and impact resistance. Their creep, temperature, and chemical resistance are also relatively good for a thermoplastic hot melt. Unfortunately, this also means that the application temperature for polyamide hot melt adhesives is much higher than what is required for conventional formulated hot melt adhesives such as those based on ethylene vinyl acetate (EVA) or styrene butadiene copolymer (SBC). This limits the applications of polyamide hot melts to substrates that are not temperature sensitive. The polyamides that are used for adhesives generally fall into three groups that are defined by molecular weight. Polyamides of differing molecular weight and chemical structure are often employed to provide specific application and performance properties.

    Resulting Properties

    Polyamide hot melt adhesives have better heat resistance than EVA or SBC types and use fewer additives. Certain types of polyamide hot melts can withstand 200°C over the short term without degradation, although creep is generally a problem. Polyamide adhesives generally exhibit sufficient properties, such as tack, without the use of additives. However, the base polyamide resin generally costs more than more conventional hot melt resins that rely on formulation for optimum performance. It is important to minimize the time when the molten resin is exposed to oxygen.

    (Source: Adhesives Formulary Handbook, NIIR Board, Asia Pacific Business Press, Inc., 2010, p. 251)

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