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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients

Thixotropic One Component ET Epoxy Adhesive

Adhesives Formulation

Applicable Base Polymer Properties

Epoxy adhesives are generally more resistant to a wide variety of liquid environments than other structural adhesives. However, the resistance to a specific environment is greatly dependent on the type of epoxy curing agent used. Thixotropic agents are used to provide non-sag properties. At one time asbestos fiber was used as the main thixotrope; however, today this has been replaced by other fibrous fillers such as cellulose fiber.

Typical Formulation Ingredients

Ingredient
Parts by weight
Epoxy resin – 1 
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Epoxy resin – 2 
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Dicyandiamide 
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Cure accelerator 
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Ground limestone 
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Fumes silica, treated 
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Cellulose fibers 
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Typical Properties

Properties
Viscosity 
 
Initial 
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Aged 
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Slump resistance (1/2”x1/2”x4”) 
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Tensile shear strength, psi 
 
Initial 
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250 hr humidity 
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250 hr salt spray 
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250 hr salt spray 
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Processing

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Resulting Properties

The above table shows a comparison of properties using fumed silica and cellulose fibers in a 1K, elevated temperature curing epoxy adhesive formulation. Note that a certain percentage of fumed silica is still required in the cellulose fiber filled formulations for optimal non-sag properties. The cellulose fibers’ low specific gravity (1.1) relative to other filler materials also contribute to weight savings that further improves the sag resistance of these systems.

Tips and Tricks

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