Expert from Arkema Coating Resins, François Vettier discussed about the “Enhanced rheological properties using polyamide additives in high-tack adhesives based on silyl-terminated polymers” at FEICA 2019.
Required Rheological Properties in Adhesive Systems
Polyamide additive technology has become a market reference in order to achieve the required rheological properties in many systems, including adhesives and sealants.
In parallel, silyl-terminated-polymer technology is increasing its market share, with high growth rates in many sectors such as construction and transportation. Additionally, needs for high-tack systems are increasing, as adhesives replace mechanical fasteners and, more generally, to enhance the end properties in application areas when specifically needed.
Suitable Rheological Profile with Enhanced Workability
For these applications, polyamide additives represent a tool of prime interest to achieve a suitable rheological profile with a good compromise between high early grab and enhanced workability.
A brief introduction of the polyamide technology, in terms of chemistry and physical properties, was shared. The paper then focused on practical examples adapted to:
- STP based high-tack formulations
- Showing different methods of characterization
- The performance of various additives regarding these properties
Finally, the performance of a newly developed polyamide product was examined, highlighting the differentiation it brings to formulators.
Source: FEICA 2019