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Bostik at Techtextil’17: Presented Range of Adhesives for Nonwoven Bonding Applications

Published on 2017-06-27. Author : SpecialChem

Bostik has recently exhibited at Techtextil North America in Chicago. Techtextil is North America’s only dedicated show for technical textiles and nonwovens. It marked its 14th edition this year. Organized by Messe Frankfurt, the show received a Trade Show News Networks’ top 250 U.S. trade show ranking for being a premier show in its industry.


Bostik Presented Range of Adhesives for Nonwoven Bonding Applications
Bostik Presented Range of Adhesives for Nonwoven Bonding Applications

Multiple Applications with Single Solution


During the event, Bostik showcased its smart hot melt and web (fusible textile) adhesives, which are ideal for a variety of textile and nonwoven bonding applications. These products offer broad performance characteristics, enabling manufacturers to address multiple applications with a single solution. Specifically, the diverse product line includes cost effective and high performing selections, improving manufacturing processes and increasing operational efficiencies.

Event Highlights


  • One of Bostik’s highlights at Techtextil was its hot melt adhesives for mattress assembly, which serves as an alternative to traditional water-based products.
  • These hot melt solutions enable manufacturers to meet production demands and high line speed requirements.
  • Additionally, some of Bostik’s web adhesives at the show offer flame retardancy, contributing to increased consumer safety.

Igor Leclere, Business Director for the Americas Industrial Adhesives unit said,:

“Techtextil gives Bostik the opportunity to showcase our technical solutions for an evolving textile market while meeting with industry professionals.”

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Source: Bostik
FEICA 2018 European Adhesive and Sealant Conference and EXPO
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